Thermo-Viscoelastic Analysis of Stress and Deflection for CSP under Heat Cycles

• Koguchi Hideo

  Nagaoka University of Technology

• Ishida Mirai

  Graduate school of Nagaoka University of Technology

• Kuroishi Tomoaki

  Matsushita Electric Industrial Co.,LTD.

• Nishida Kazuto

  Matsushita Electric Industrial Co.,LTD.

Bibliographic Information

Other Title

• CSPの熱サイクル下における応力とたわみの熱粘弾性解析(OS1b 電子デバイス実装・電子材料と計算力学)

Journal

• The Proceedings of The Computational Mechanics Conference

  The Proceedings of The Computational Mechanics Conference 2004.17 (0), 783-784, 2004

  The Japan Society of Mechanical Engineers

Keywords

• Thermo-Viscoelastic Analysis
• Chip Size Package
• Flip Chip
• Finite Element Method

Details

• CRID: 1390001205859026176
• NII Article ID: 110004070582
• DOI: 10.1299/jsmecmd.2004.17.783
• ISSN: 24242799
• Web Site: https://www.jstage.jst.go.jp/article/jsmecmd/2004.17/0/2004.17_783/_pdf
• Text Lang: ja
• Data Source:
  • JaLC
  • Crossref
  • CiNii Articles