Evolution Equation of Creep for Elastic-Plastic-Creep Constitutive Model of Lead-Free Solder

• OHGUCHI Ken-ichi

  Akita University

• SASAKI Katsuhiko

  Hokkaido University

• ISHIBASHI Masahiro

  NEC

Bibliographic Information

Other Title

• 鉛フリーはんだの弾塑性クリープ構成式におけるクリープ成分記述の検討(OS1b 電子デバイス実装・電子材料と計算力学)

Journal

• The Proceedings of The Computational Mechanics Conference

  The Proceedings of The Computational Mechanics Conference 2004.17 (0), 785-786, 2004

  The Japan Society of Mechanical Engineers

Keywords

• Lead Free Solder
• Constitutive Model
• Creep
• Stress Relaxation
• Strain Rate Effect

Details

• CRID: 1390282680835734016
• NII Article ID: 110004070583
• DOI: 10.1299/jsmecmd.2004.17.785
• ISSN: 24242799
• Web Site: https://www.jstage.jst.go.jp/article/jsmecmd/2004.17/0/2004.17_785/_pdf
• Text Lang: ja
• Data Source:
  • JaLC
  • Crossref
  • CiNii Articles