Derivations of Correlation and Liquid-Solid Contact Model of Transition Boiling Heat Transfer

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The correlation of liquid-solid contact fraction in transition boiling was derived by focusing on the dimensionless wall temperature θ=(<i>T</i><sub><i>w</i></sub>-<i>T<sub>CHF</sub></i>)/(<i>T<sub>MHF</sub></i>-<i>T<sub>CHF</sub></i>). The following correlation was obtained from experimental results for water, R-113 and LN<sub>2</sub>: <i>Γ</i>=1.000-0.9120θ-0.1343θ<sup>2</sup>, where <i>q<sub>tb</sub></i>=<i>q<sub>CHF</sub></i><i>Γ</i>+<i>q<sub>MHF</sub></i>(1-<i>Γ</i>). In the present model, considering a pseudo-liquid solid contact right after the detachment of a bubble from a liquid-vapor interface, transient heat conduction was analyzed in it three-dimensionally. Liquid-solid contact time and area were determined by the present correlation of the fractions of liquid-solid contact: τ<i><sub>contact</sub></i>=0.3<i>Γ</i><sub><i>t</i></sub>, <i>A<sub>wet</sub></i>=15 × 15 × <i>Γ</i><i><sub>a</sub></i>, <i>Γ</i><i><sub>t</sub></i>=<i>Γ</i><i><sub>a</sub></i>=<i>Γ</i><sup>0.5</sup>={1.000-0.9120θ-0.1343θ<sup>2</sup>}<sup>0.5</sup>. The heat transfer during the wet period was estimated using <i>q<sub>wet</sub></i>=<i>f</i>(Δ<i>T<sub>sat</sub></i><sup>0.8</sup>). The prediction by the present model was in agreement with the present experimental data for water. Furthermore, a simulation of the rewetting was performed; the experimental results of cooling curves during the rewetting were well reproduced by the transient heat conduction model using the present correlation of transition boiling heat transfer and the present liquid-solid contact model.

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  • JSME international journal. Ser. B, Fluids and thermal engineering

    JSME international journal. Ser. B, Fluids and thermal engineering 49(2), 343-351, 2006-05-15

    一般社団法人日本機械学会

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各種コード

  • NII論文ID(NAID)
    110004717687
  • NII書誌ID(NCID)
    AA10888815
  • 本文言語コード
    ENG
  • 資料種別
    ART
  • ISSN
    13408054
  • NDL 記事登録ID
    7902952
  • NDL 雑誌分類
    ZN11(科学技術--機械工学・工業)
  • NDL 請求記号
    Z53-Y271
  • データ提供元
    CJP書誌  NDL  NII-ELS  J-STAGE 
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