Electron Back-Scatter Pattern Analyses of a Recrystallized Al-4mass%Mg Alloy Sheet(Materials, Metallurgy & Weldability)

• SHIBAYANAGI T.

  Osaka University

• NAKA Masaaki

  Osaka University

抄録

Spatial distributions of grain orientation and grain boundary character distribution in a recrystallized Al-4mass%Mg alloy sheet have been investigated using the Electron Back Scatter Pattern (EBSP) method. The evaluation of microstructure was performed for the specimen recrystallized at 773K for 1ks. Weak cube textures were observed for the specimen taken from the central portion of the thickness, and sheared texture component tended to be dominant in the surface region of the sheet. Cube oriented grains existed in both isolated and aggregated sates. The cluster of cube grains tended to contain low angle grain boundaries. Observation of grain boundary migration on the same area revealed heterogeneous behavior of triple junctions resulting in a wide variety of microstructural change.

収録刊行物

• Trans. JWRI

  Trans. JWRI 30 (1), 63-70, 2001

  大阪大学

キーワード

• EBSP
• Al-4Mg alloy
• recrystallization
• texture
• grain boundary character distribution
• grain boundary migration
• triple junction

詳細情報

• CRID: 1570854177302909440
• NII論文ID: 110006486103
• NII書誌ID: AA00867058
• ISSN: 03874508
• 本文言語コード: en
• データソース種別:
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