2621 CMPパッドにおける同心円溝内部のスラリー輸送の詳細数値解析(S44-3 マイクロ・ナノ流れの数値解析,S44 マイクロ・ナノフルイディクス)  [in Japanese] 2621 Detailed Numerical Analysis on Slurry Flow in Circular Groove of CMP Pad  [in Japanese]

Slurry flow in CMP (Chemical Mechanical Polishing) process between the wafer and the polishing pad was studied. Numerical simulations were carried out for pad with circular grooves. One role of grooves is to replace old slurry to new slurry quickly by transporting the slurry. Another is to carry particles away to prevent deep scratches. Studying the surrey flow and transport in the grooves in details, the role of circular grooves is clar ified.