光ファイバ伝送レーザ光を直接利用したシリコンのレーザアシストエッチング加工

• 山下 祥宣

  東京工業大学大学院

• 細野 高史

  信州大学工学部

• 比田井 洋史

  東京工業大学大学院

• 戸倉 和

  東京工業大学大学院

書誌事項

タイトル別名

• Processing of Silicon by Direct Irradiation of Laser Beam Transmitted Through Optical Fiber
• ヒカリ ファイバ デンソウ レーザコウ オ チョクセツ リヨウシタ シリコン ノ レーザ アシスト エッチング カコウ

抄録

Drilling of crystalline silicon with a laser beam emerged from an as-cut glass optical fiber in wet etchant has been investigated in this report. This method enables deeper drilling than conventional laser drilling methods such as focusing a beam with a lens, because the beam can be delivered to the bottom of the hole by inserting the fiber in the hole. KOH based solution was used for the etchant and H₂O₂ was added to it in order to prevent the etching of the non-irradiated area. A CW Ar laser and a frequency doubled pulsed Nd:YLF laser were compared. Through-hole drilling of the wafer (0.5mm thickness) was investigated using different types of laser source. The average powers of the lasers were 10W. With the Ar ion laser 40 min. irradiation was needed to perforate the wafer and the hole was cone-shaped. On the other hand, with the Nd:YLF laser, through holes were drilled in less than 1 min. of irradiation and the hole had a smoother and sharper wall than with the Ar laser. No damage was observed on the optical fiber. Through holes were also drilled on 3mm-thick wafers.

収録刊行物

• 精密工学会誌

  精密工学会誌 74 (5), 463-467, 2008

  公益社団法人 精密工学会

キーワード

• silicon
• laser assisted wet etching
• KOH
• optical fiber

詳細情報

• CRID: 1390282679774270976
• NII論文ID: 110006668357
• NII書誌ID: AN1003250X
• DOI: 10.2493/jjspe.74.463
• ISSN: 1882675X
• ISSN: 09120289
• NDL書誌ID: 9505983
• Web Site: https://ndlsearch.ndl.go.jp/books/R000000004-I9505983
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