PB3 光音響顕微鏡によるSiウェハ表面下30nm幅クラックの検出と画像化(ポスターセッション概要講演) [in Japanese] PB3 Detection and Imaging of Subsurface Cracks of 30nm Width in Silicon Wafer Using Photoacoustic Microscope [in Japanese]

- 中田俊彦 Nakata Toshihiko
- 日立生研 Production Engineering Research Laboratory, Hitachi, Ltd.
- 見坊行雄 Kembo Yukio
- 日立生研 Production Engineering Research Laboratory, Hitachi, Ltd.
- 北森武彦 Kitamori Takehiko
- 東大工 Department of Industrial Chemistry, Faculty of Engineering, the University of Tokyo
- 澤田嗣郎 Sawada Tsuguo
- 東大工 Department of Industrial Chemistry, Faculty of Engineering, the University of Tokyo

Read/Search this Article

Journal

Symposium on ultrasonic electronics [List of Volumes]

Symposium on ultrasonic electronics (12), 59-60, 1991-12-02 [Table of Contents]

Steering committee of symposium on ultrasonic electronics

Preview

Codes

NII Article ID (NAID) :
110007460261
NII NACSIS-CAT ID (NCID) :
AN10578660
Text Lang :
JPN
Databases :

NII-ELS