K1 弾性表面波デバイスを用いる時分割多元接続方式(弾性表面波デバイス)  [in Japanese] K1 TDMA System Using SAW Devices  [in Japanese]

Journal

Symposium on ultrasonic electronics   [List of Volumes]

Symposium on ultrasonic electronics (13), 265-266, 1992-11-30  [Table of Contents]

Steering committee of symposium on ultrasonic electronics

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Codes

  • NII Article ID (NAID) :
    110007460567
  • NII NACSIS-CAT ID (NCID) :
    AN10578660
  • Text Lang :
    JPN
  • Databases :
    NII-ELS