PC6 エピタキシャルリフトオフ技術を用いた半導体-SAW複合素子(ポスターセッション3-概要講演・展示)  [in Japanese] PC6 Semiconductor-SAW coupled device employing epitaxial lift-off technology  [in Japanese]

Journal

Symposium on ultrasonic electronics   [List of Volumes]

Symposium on ultrasonic electronics (16), 143-144, 1995-11-27  [Table of Contents]

Steering committee of symposium on ultrasonic electronics

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Codes

  • NII Article ID (NAID) :
    110007460929
  • NII NACSIS-CAT ID (NCID) :
    AN10578660
  • Text Lang :
    JPN
  • Databases :
    NII-ELS