PF12 エピタキシャルリフトオフ技術を用いた半導体・弾性表面波複合素子(ポスターセッション3) [in Japanese] PF12 Study on integration of semiconductor device with SAW using the epitaxial lift-off process [in Japanese]

- 鈴木博次 Suzuki Hiroji
- 明電舎 Meidensha Co.
- 小峰賢二 Komine Kenji
- 明電舎 Meidensha Co.
- 黄啓新 Huang Quixin
- 神工大工 Department of Electrical & Electronic Engineering, Kanagawa Institute of Technology
- 宝川幸司 Hohkawa Kohji
- 神工大工 Department of Electrical & Electronic Engineering, Kanagawa Institute of Technology

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Journal

Symposium on ultrasonic electronics [List of Volumes]

Symposium on ultrasonic electronics (17), 325-326, 1996-10-23 [Table of Contents]

Steering committee of symposium on ultrasonic electronics

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NII Article ID (NAID) :
110007461167
NII NACSIS-CAT ID (NCID) :
AN10578660
Text Lang :
JPN
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