PG10 Measurement of Temperature Rise at Welding Surface of Wire Bonding of Aluminum and Copper Specimens Using 190 kHz Linear, Circular and Square Vibration, and 600 kHz Linear Vibration Locus Welding Tips

PG10 振動軌跡形状および周波数による超音波ワイヤーボンディングの温度上昇および接合特性について(ポスターセッション2) [in Japanese] PG10 Measurement of Temperature Rise at Welding Surface of Wire Bonding of Aluminum and Copper Specimens Using 190 kHz Linear, Circular and Square Vibration, and 600 kHz Linear Vibration Locus Welding Tips [in Japanese]

- 辻野次郎丸 TSUJINO Jiromaru
- 神奈川大学工学部 Faculty of Engineering, KANAGAWA University
- 吉原弘行 YOSHIHARA Hiroyuki
- 神奈川大学工学部 Faculty of Engineering, KANAGAWA University
- 伊東知彦 ITOH Tomohiko
- 神奈川大学工学部 Faculty of Engineering, KANAGAWA University
- 犬嶋一聡 INUJIMA Kazutoshi
- 神奈川大学工学部 Faculty of Engineering, KANAGAWA University
- 平野恭幸 HIRANO Yasuyuki
- 神奈川大学工学部 Faculty of Engineering, KANAGAWA University

Symposium on ultrasonic electronics [List of Volumes]

Symposium on ultrasonic electronics (18), 185-186, 1997-11-12 [Table of Contents]

Steering committee of symposium on ultrasonic electronics