PB-3 音速による接着樹脂層の硬化度推定  [in Japanese] PB-3 A simple nondestructive evaluation of the curing epoxy adhesives using wave velocities  [in Japanese]

Journal

Symposium on ultrasonic electronics   [List of Volumes]

Symposium on ultrasonic electronics (20), 115-116, 1999-11-17  [Table of Contents]

Steering committee of symposium on ultrasonic electronics

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Codes

  • NII Article ID (NAID) :
    110007461510
  • NII NACSIS-CAT ID (NCID) :
    AN10578660
  • Text Lang :
    JPN
  • Databases :
    NII-ELS