H-2 EB露光とリフトオフ法によるGHz帯SAWデバイスの作製(弾性表面波デバイス,口頭発表)  [in Japanese] H-2 Fabrication of GHz SAW Devices by EB-Based Lift-Off Process  [in Japanese]

Journal

Symposium on ultrasonic electronics   [List of Volumes]

Symposium on ultrasonic electronics (23), 375-376, 2002-11-07  [Table of Contents]

Steering committee of symposium on ultrasonic electronics

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Codes

  • NII Article ID (NAID) :
    110007464544
  • NII NACSIS-CAT ID (NCID) :
    AN10578660
  • Text Lang :
    JPN
  • Databases :
    NII-ELS