220 Effects of Surface Copper Film Bonding on Fatigue Crack Propagation Behavior : Noting Bonding Method and Film Grain Size

• NAKAMURA Satoshi

  Okayama University

• TORII Tashiyuki

  Okayama University

• SHIMIZU Kenichi

  Okayama University

• MATSUBA Akira

  Hiroshima Prefectural Technology Research Institute

Bibliographic Information

Other Title

• 220 疲労き裂伝ぱ挙動に及ぼす表面銅膜接着の影響 : 膜接合形態と膜結晶粒径に注目して(材料力学IV)

Journal

• The Proceedings of Conference of Chugoku-Shikoku Branch

  The Proceedings of Conference of Chugoku-Shikoku Branch 2008.46 (0), 79-80, 2008

  The Japan Society of Mechanical Engineers

Details

• CRID: 1390001205861330304
• NII Article ID: 110007708699
• DOI: 10.1299/jsmecs.2008.46.79
• ISSN: 24242764
• Web Site: https://www.jstage.jst.go.jp/article/jsmecs/2008.46/0/2008.46_79/_pdf
• Text Lang: ja
• Data Source:
  • JaLC
  • Crossref
  • CiNii Articles