2A2-G09 力制御と視覚による位置制御を利用したサブミリメートル電子部品のハンドリング(生産システム・生産機器メカトロニクス)  [in Japanese] 2A2-G09 Handling of Submillimeter-sized Electronic Parts Using Force Control and Vision-based Position Control  [in Japanese]

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Author(s)

Abstract

This paper presents handling of small electronic parts whose size is submillimeter or smaller. For assembly of small parts which compose electronic devices or micro robots, we need two key technologies: accurate position control and force control while handling them. In this paper, we utilize a four degree-of-freedom assembly robot with a camera for position control. This vision-based assembly system gives us positioning accuracy of micrometer order. Pressing load in pick-and-place of small objects is controlled by PID control with mechanical springs and a displacement sensor. We execute some experiments to handle small electronic parts using above-mentioned force control and vision-based position control.

Journal

  • ロボティクス・メカトロニクス講演会講演概要集   [List of Volumes]

    ロボティクス・メカトロニクス講演会講演概要集 2007, "2A2-G09(1)"-"2A2-G09(4)", 2007-05-11  [Table of Contents]

    The Japan Society of Mechanical Engineers

Codes

  • NII Article ID (NAID)
    110008695569
  • NII NACSIS-CAT ID (NCID)
    AA11902933
  • Text Lang
    JPN
  • Data Source
    NII-ELS 
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