T0302-3-2 銅膜材のき裂開口変位計測に基づく疲労き裂伝ぱ挙動の評価([T0302-3]高信頼マイクロ・ナノデバイスのための設計・計測技術(3):微小構造部材の加工・評価)

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  • T0302-3-2 Evaluation of Fatigue Crack Propagation Behavior Based on Crack Opening Displacement Distribution in Copper Films

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Pure copper films of 100μm thickness with different grain sizes were fatigued with a stress ratio of R=0 and crack opening displacement distributions were measured by using digital image correlation method. As a result, the fatigue crack initiation and propagation from the notch of the film were faster for the film with a small grain size than for the film with a large grain size. The crack opening displacement distributions were higher for the film with a small grain size than for the film with a large size. Moreover, the temporary arrest or retardation of the fatigue crack growth was often observed in a case the film with a large grain. Using the stress intensity factor estimated from the crack opening displacement, the fatigue crack propagation rates were evaluated by the same equaion between the film with the large grain size and the small grain size.

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