J012012 回路基板のスルーホール周りの疲労強度([J012-01]電子情報機器、電子デバイスの強度・信頼性評価と熱制御(1))

• 木下 貴博

  富山県立大学

• 川上 崇

  富山県立大学

• 水科 秀樹

  沖プリンデッド株式会社

• 飯長 裕

  沖プリンデッド株式会社

書誌事項

タイトル別名

• J012012 Fatigue Strength around Through Hole in Printed Circuit Board

抄録

Through holes were formed in printed circuit board for electric signal communication. The surface of through hole was plated by thin metal and the irregularities were shaped on the free-surface or on the interface by hole-drilling in printed circuit board. Fracture of through hole was occurred by stress concentration due to its irregularity. In this study, elastic-plastic thermal stress simulation was performed by using a large scale simulator ADVENTURECluster which was based on FEM to study fatigue strength around through hole in printed circuit board.

収録刊行物

• 年次大会

  年次大会 2013 (0), _J012012-1-_J012012-4, 2013

  一般社団法人 日本機械学会

キーワード

• Fatigue Strength
• Through Hole
• FEM
• Stress Concentration

詳細情報

• CRID: 1390001205841291520
• NII論文ID: 110009934580
• DOI: 10.1299/jsmemecj.2013._j012012-1
• ISSN: 24242667
• Web Site: https://www.jstage.jst.go.jp/article/jsmemecj/2013/0/2013__J012012-1/_pdf
• 本文言語コード: ja
• データソース種別:
  • JaLC
  • Crossref
  • CiNii Articles
• 抄録ライセンスフラグ: 使用不可