J012032 1次元熱回路網による電子機器の非定常熱解析熱抵抗の時間遷移のモデル化([J012-03]電子情報機器、電子デバイスの強度・信頼性評価と熱制御(3))

書誌事項

タイトル別名
  • J012032 Transient Thermal Analysis for Electronic Equipment Utilizing One-Dimensional Thermal Network Modeling of Transient Thermal Resistance Behavior

抄録

This paper discusses modeling of transient thermal resistance behavior aiming at microprocessor silicon die temperature prediction. Temperature gradient prediction between two different-sized objects along heat conduction paths is one of key factors to obtain calculation result with practical accuracy in transient state. It is referred as thermal spreading resistance in this paper and modeling of its transient behavior is investigated as a part of one-dimensional thermal network with average temperature nodes which is introduced in previous work of this research.

収録刊行物

  • 年次大会

    年次大会 2013 (0), _J012032-1-_J012032-5, 2013

    一般社団法人 日本機械学会

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