書誌事項
- タイトル別名
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- J012032 Transient Thermal Analysis for Electronic Equipment Utilizing One-Dimensional Thermal Network Modeling of Transient Thermal Resistance Behavior
抄録
This paper discusses modeling of transient thermal resistance behavior aiming at microprocessor silicon die temperature prediction. Temperature gradient prediction between two different-sized objects along heat conduction paths is one of key factors to obtain calculation result with practical accuracy in transient state. It is referred as thermal spreading resistance in this paper and modeling of its transient behavior is investigated as a part of one-dimensional thermal network with average temperature nodes which is introduced in previous work of this research.
収録刊行物
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- 年次大会
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年次大会 2013 (0), _J012032-1-_J012032-5, 2013
一般社団法人 日本機械学会
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詳細情報
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- CRID
- 1390001205841444864
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- NII論文ID
- 110009934584
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- ISSN
- 24242667
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- 本文言語コード
- ja
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- データソース種別
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- JaLC
- Crossref
- CiNii Articles
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- 抄録ライセンスフラグ
- 使用不可