書誌事項
- タイトル別名
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- OS0507 Method to Estimate the Steady-state Creep Deformation for the Solder Joint by Indentation Test
抄録
To evaluate the strength reliability of electronic substrate by the accurate structural analysis, the method to evaluate the creep deformation of in-situ solder joints must be developed. The Indentation creep test is one of effective method to evaluate the creep deformation in microscopic specimen. It is required that the result obtained by the indentation creep test is should be expressed by the constitutive equation for the creep deformation under the uniaxial stress evaluated by the tensile creep test In this paper, the indentation creep test at IN loading for 9000s duration is conducted by experiment and the result obtained by the indentation creep test is compared with that obtained by the tensile creep test using the bulk specimen. As the result, the result obtained by the indentation creep test did not coincide with that obtained by the tensile creep test To explain the difference, the numerical indentation creep test is conducted. Finally, the method to determine the suitable reference area for calculating uniaxial stress of the indentation test is proposed. The reference area determined by the new indentation test is the effective to obtain the reasonable creep curves by the indentation test.
収録刊行物
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- M&M材料力学カンファレンス
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M&M材料力学カンファレンス 2014 (0), _OS0507-1_-_OS0507-2_, 2014
一般社団法人 日本機械学会
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詳細情報 詳細情報について
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- CRID
- 1390001205875994624
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- NII論文ID
- 110009939488
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- ISSN
- 24242845
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- 本文言語コード
- ja
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- データソース種別
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- JaLC
- Crossref
- CiNii Articles
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- 抄録ライセンスフラグ
- 使用不可