J0310103 フローハンダ付け工程のCFDシミュレーション : 狭いマスクキャリア開口部へのハンダ充填([J031-01]電子情報機器・半導体デバイス・電子部品の冷却技術(1),材料力学部門)

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タイトル別名
  • J0310103 CFD simulation of flow soldering : solder filling in narrow opening of mask

抄録

Flow soldering process with a simple model has been studied using CFD. A printed circuit board with through-hole components and with surface-mounted components covered with a mask is the object of this study. In this process, surface mounted components are first soldered and covered with the mask; then through-hole components without the mask are soldered by dipping the board into a solder bath. We investigate the solder flow in a narrow opening between the masks. Surface tension and contact angles are decided by comparison with experiments.

収録刊行物

  • 年次大会

    年次大会 2014 (0), _J0310103--_J0310103-, 2014

    一般社団法人 日本機械学会

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