J0410205 深さ保持インデンテーション試験による鉛フリーはんだのクリープ特性評価

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タイトル別名
  • J0410205 Creep Deformation Estimation of the Lead-free Solder by Indentation Test with Constant Depth Process

抄録

To evaluate the strength reliability of the electronic substrate accurately, the deformation behavior, especially, the creep deformation of the solder joint should be estimated in-situ. The indentation creep test is one of the effective test to evaluate the creep deformation in the microscopic region. However, this test has the problem that the stress is overestimated by employing the contact area between the indenter and the specimen as the reference of the stress evaluation. To solve the problem, methods to determine the suitable area for the indentation test and to evaluate the creep deformation by using the suitable area were numerically proposed by the authors. In the proposed method, the principal stress plane approximated by the spherical surface is defined as the reference area to calculate the stress assuming that the specimen is homogeneous. In this paper, the indentation process is simulated by using the inhomogeneous model of the specimen to confirm that the principal stress plane is assumed as the spherical surface. The actual indentation test with a constant depth process is also conducted using Sn-3.0Ag-0.5Cu solder specimens to verify the applicability of the proposed method to the actual indentation test.

収録刊行物

  • 年次大会

    年次大会 2015 (0), _J0410205--_J0410205-, 2015

    一般社団法人 日本機械学会

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