Codeposition of a-alumina particles from acid copper sulfate bath

• Hayashi, Hidetaka

• Izumi, Shin-ya

• Tari, Isao

抄録

The purpose of this work is to elucidate the factors affecting the codeposition of a-alumina particles with copper from an acid copper sulfate bath. The effect of current density and particle concentration in the bath on the amount of codeposited a-alumina were determined. In order to evaluate the surface-chemical properties of the particles, the zeta-potential of a-alumina particles in the plating bath was determined by means of the streaming potential method. The amounts of adsorbed Cu 2+ and SO2( from the plating bath were also determined. The amount of codeposited a-alumina particles was found to be greater than those reported in literature, in spite of the negative zeta-potential values of a-alumina. This indicates that the electrostatic interaction between the particles and the cathode is not the essential factor of the codeposition process. It is considered that the amount of adsorbed Cu 2+ on the a-alumina particle plays an important role in the codeposition behavior.

収録刊行物

• Journal of the Electrochemical Society

  Journal of the Electrochemical Society 140 (2), 362-365, 1993-02

キーワード

• Deposition
• Kinetics

詳細情報

• CRID: 1050002212335242624
• NII論文ID: 120002307000
• Web Site: https://ousar.lib.okayama-u.ac.jp/34179
• 本文言語コード: en
• 資料種別: journal article
• データソース種別:
  • IRDB
  • CiNii Articles