高密度実装機器の複合領域最適配置設計のための放熱特性のコンカレント評価法に関する基礎的研究 Basic Study of Concurrent Evaluation Method of Thermal Performance for Multi-Disciplinary Optimal Layout Design of Highly Packed Equipments

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抄録

Layout design of highly packed equipments is governed by not only its geometric conditions but also its physical conditions, such as thermal performance, structural strength, electromagnetic shielding. Its characteristic shares some concepts with the paradigm of multidisciplinary design optimization (MDO). However, applicability of MDO is still natively limited within continuous optimization problems. This paper proposes a basic idea for optimization-based layout design approaches, in which layout space is minimized and thermal performance is optimized simultaneously. In the approach, the three-dimensional layout topology is represented with sequence quintuple and optimized with simulated annealing (SA), while thermal performance is evaluated by thermal network method concurrently at the arranged stages in the double loop of the developed SA algorithm. The relationship between concurrency of evaluation and solution quality is discussed with numerical experiments.

収録刊行物

  • 日本機械学会論文集 C編  

    日本機械学会論文集 C編 77(783), 3990-4000, 2011 

    The Japan Society of Mechanical Engineers

各種コード

  • NII論文ID(NAID)
    130001433481
  • 本文言語コード
    UNK
  • ISSN
    0387-5024
  • データ提供元
    J-STAGE 
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