The Effects of Thermal Cyclic Annealing in Copper Single Crystals

• Hasegawa Tadashi

  Department of Materials Science, Faculty of Engineering, Tohoku University

• Ishii Yoshitomo

  Department of Materials Science, Faculty of Engineering, Tohoku University

• Karashima Seiichi

  Department of Materials Science, Faculty of Engineering, Tohoku University

Abstract

Copper single crystals grown in vacuum (10⁻⁴∼10⁻⁵mm Hg) by the Bridgman method were subjected to the following three kinds of annealing treatments in vacuum (∼2×10⁻⁵mm Hg): (1) thermal cyclic annealing using a moving furnace, (2) thermal cyclic annealing using a fixed furnace, and (3) isothermal annealing. Changes in the dislocation distribution, the dislocation density, and the length of sub-boundaries per unit area with annealing time or annealing cycle were examined by means of the etch-pit technique.<BR>Thermal cyclic annealing was much more effective than isothermal annealing in reducing the dislocation density and the length of sub-boundaries. Little differences were observed between thermal cyclic annealings using a moving furnace and a fixed furnace. Thermal cyclic annealing was more effective in crystals with large subgrains than in crystals with small subgrains.<BR>In crystals with subgrains larger than a few millimetres, the dislocation density of the order of 10⁵/cm² was reduced to ∼2×10³/cm² by thermal cyclic annealing for about 100 hr with a period of 15 or 30 min.

Journal

• Transactions of the Japan Institute of Metals

  Transactions of the Japan Institute of Metals 11 (5), 328-334, 1970

  The Japan Institute of Metals

Keywords

• General Engineering

Details

• CRID: 1390282680094003072
• NII Article ID: 130003485045
• DOI: 10.2320/matertrans1960.11.328
• ISSN: 24324701
• ISSN: 00214434
• Web Site: https://www.jstage.jst.go.jp/article/matertrans1960/11/5/11_5_328/_pdf
• Text Lang: en
• Data Source:
  • JaLC
  • Crossref
  • CiNii Articles
• Abstract License Flag: Disallowed