軟鑞接に関する研究
書誌事項
- タイトル別名
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- Study on the Soft Soldering
- ハンダの組成と純銅板に対する拡延性に就て
抄録
Pb-Sn alloys of various compositions were used as soft solders for the research Each 0.1 g of solder was put on thin copper plate which preheated to a desired temperature in the thermostat 0.5 c c of zinc-chloride solution or other fluxes was applied on the solder by pipette. Then the spread area of solder was determined by the planimeter.<BR>(1) A maximum spread area was found at the solder of eutectic composition.<BR>(2) In all kinds of compositions of the solders a maximum spread area was obtained at 260°C when the saturated solution of zinc-chloride was used as a flux.<BR>Some interesting problems about the soft soldering was found in the experiment and described in this paper.
収録刊行物
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- 溶接学会誌
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溶接学会誌 22 (7), 227-231, 1953
一般社団法人 溶接学会
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詳細情報 詳細情報について
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- CRID
- 1390001206500843392
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- NII論文ID
- 130003762561
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- ISSN
- 18837204
- 00214787
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- 本文言語コード
- ja
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- データソース種別
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- JaLC
- Crossref
- CiNii Articles
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- 抄録ライセンスフラグ
- 使用不可