書誌事項
- タイトル別名
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- A Study on Wetting by Solders by Surface Tension Methods (Report 1)
- 平衡ぬれ
抄録
Important factors in testing methods of quantitatively evaluating the wettability of a soldering system are discussed. It is shown that adhesion tension obtained directly by the surface tension method is a basic important factor governing wetting phenomena, and that the wetting behaviour may be interpreted from various points of view such as spreading or penetration characteristics of the soldering system. Experimental results obtained by surface tension methods on the equilibrium wetting of copper by tin-lead solders with rosin flux are described. These give an explanation of the discrepancies between the results of area-of-spread and capillary-penetration tests and give an insight into the slight difference between the results of area-of-spread tests and the practical assessments of soldering performance. It is found that adhesion tension exerts dominant influences on practical soldering, and the surface tension method can be expected to be useful for the quantitative evaluation of actual solderability.
収録刊行物
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- 溶接学会誌
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溶接学会誌 47 (8), 507-513, 1978
一般社団法人 溶接学会
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詳細情報 詳細情報について
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- CRID
- 1390001206502501632
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- NII論文ID
- 130003763442
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- COI
- 1:CAS:528:DyaE1MXhtV2mtg%3D%3D
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- ISSN
- 18837204
- 00214787
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- 本文言語コード
- ja
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- データソース種別
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- JaLC
- Crossref
- CiNii Articles
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- 抄録ライセンスフラグ
- 使用不可