Metallurgical Study of TLP-Bonding of Ni-Base Single Crystal Superalloy, CMSX-2. Transient Liquid Phase Bonding of Ni-Base Single Crystal Superalloy (Report 2).

DOI 2 Citations

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Other Title
  • Ｎｉ基単結晶超合金ＣＭＳＸ‐２の液相拡散接合部の組織学的検討　Ｎｉ基単結晶超合金の液相拡散接合に関する研究　第２報
  • Transient Liquid Phase Bonding of Ni-Base Single Crystal Superalloy (Report 2)
  • Ni基単結晶超合金の液相拡散接合に関する研究(第2報)

Abstract

The dissolution of base metal and isothermal solidification behaviors of Ni-base single crystal superalloy, CMSX-2 during transient liquid phase (TLP) bonding was investigated employing MBF-80 and F-24 insert metals. TLP-bonding of CMSX -2 was carried out at 1373-1548 K for 0-19.6 ks in vacuum. The (001) orientation of each test specimen was always aligned perpendicular to the bonding interface. The dissolution width of base metal at the bonding temperature increased when the bonding temperature and holding time were increased. The dissolution phenomena of base metal into melted insert metal could be expressed by Nernst-Brunner's theory. The eutectic width diminished linearly with the square root of holding time during isothermal solidification process. Borides were formed in the bonded layer during TLP-bonding operation. The amount of microconstituents in the bonded layer after isothermal solidification decreased with bonding temperature, and the microconstituents in the bonded layer disapperaed at the bonding condition of 1523 K × 1.8 ks when MBF-80 insert metal was used.

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Details 詳細情報について

  • CRID
    1390282679698587776
  • NII Article ID
    130003764534
  • DOI
    10.2207/qjjws.14.731
  • ISSN
    24348252
    02884771
  • Text Lang
    ja
  • Data Source
    • JaLC
    • Crossref
    • CiNii Articles
  • Abstract License Flag
    Disallowed

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