接合機構領域図による固相接合過程の検討

• 西口 公之

  大阪大学工学部

• 高橋 康夫

  大阪大学工学部

• 小口 力

  大阪大学工学部

書誌事項

タイトル別名

• Analysis of the solid state bonding process by the diagrams of bonding mechanisms.

抄録

It has been said that formation-process of bonded area in the solid state bonding is attained by two or more distinguishable mechanisms (plastic deformation, creep flow, interface-diffusion and volumediffusion). In the present paper, the diagrams of bonding mechanisms for copper are drawn, using three axes of bonding pressure P, bonding temperature T and percent bonded area S for the purpose of classifying the bonding processes. The diagrams allow the bonding process to be visualized by identifying the dominant mechanisms, resulting in the solid state bonding systematically divided into two processes of deformation and diffusion in terms of the dominant mechanisms. Also, the mechanism maps with contour curves are useful in planning the bonding process.

収録刊行物

• 溶接学会論文集

  溶接学会論文集 4 (2), 311-316, 1986

  一般社団法人 溶接学会

キーワード

• Solid State Bonding
• Bonding Mechanism
• Diffusion Bonding

詳細情報

• CRID: 1390282679698581504
• NII論文ID: 130003764754
• DOI: 10.2207/qjjws.4.311
• ISSN: 24348252
• ISSN: 02884771
• 本文言語コード: ja
• データソース種別:
  • JaLC
  • Crossref
  • CiNii Articles
• 抄録ライセンスフラグ: 使用不可