蒸着薄膜および電着メッキ層の残留応力解析

• 豊田 政男

  大阪大学

• 吹田 義一

  高松工業高等専門学校

• 平野 俊雄

  高松工業高等専門学校

• 中村 茂昭

  東洋オプトデバイス(株)

• 山本 斌曠

  東洋オプトデバイス(株)

• 草薙 一正

  東洋オプトデバイス(株)

• 三谷 英機

  阿南工業高等専門学校

書誌事項

タイトル別名

• Analysis of residual stresses in evaporated and plating films.

抄録

This paper is concerned with the theoretical evaluation of residual stresses in multilayered structures fabricated on substrates, such as evaporated films and plating films.<BR>Firstly, the analysis of thermal stresses in multilayered elastic thin films is carried out by using the method of strain suppression. Next, the theoretical formulas for evaluation of residual stresses arising in thin films and substrates are derived by the use of combining the results of the thermal stress analysis and those of stresses due to the inherent strains of the thin film. Furthermore the controlling parameters of residual stresses are derived theoretically.<BR>Experimental results of residual stresses in evaporated Ag films and hard chrominum plating films agree approximately with theoretical ones.

収録刊行物

• 溶接学会論文集

  溶接学会論文集 7 (4), 543-548, 1989

  一般社団法人 溶接学会

キーワード

• Thin film
• Residual stress
• Evaporated film
• Plating film
• Multilayered structure
• Inherent strain

詳細情報

• CRID: 1390282679703512576
• NII論文ID: 130003764870
• DOI: 10.2207/qjjws.7.543
• ISSN: 24348252
• ISSN: 02884771
• 本文言語コード: ja
• データソース種別:
  • JaLC
  • Crossref
  • CiNii Articles
• 抄録ライセンスフラグ: 使用不可