フェノール硬化型エポキシ樹脂の橋かけ密度と緩和挙動

書誌事項

タイトル別名
  • Cross-linking density and relaxation behavior of phenolic cured epoxy resins.

抄録

The relationship between cross-linking density (ρ (E′)) and free volume was investigated for epoxy resins having different ρ (E′) values. These resins were prepared from a given epoxy compound by using various accelerators. The time-temperature superposition was found to hold for the relaxation moduli of the cured epoxy resins. The shift factor αT showed a temperature dependence of the WLF equation type. The obtained WLF parameters Cg1 and Cg2 gave values of free volume fraction at Tg (fg) and thermal expansion coefficient (αf), which were considerably different from the universal values (fg=0.025, αf=4.8×10-4deg-1) found by Ferry et al. The fg decreased with an increase of the ρ (E′). This tendency contradicted the fact that highly cross-linked epoxy resin had a larger specific volume in the glassy state. On the other hand, αf became smaller with increasing ρ (E′). This results agreed with the fact that the difference of thermal expansion coefficient above and below Tg decreased with increasing ρ (E′).

収録刊行物

  • 高分子論文集

    高分子論文集 46 (7), 413-419, 1989

    公益社団法人 高分子学会

被引用文献 (2)*注記

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詳細情報 詳細情報について

  • CRID
    1390282681498767104
  • NII論文ID
    130003837215
  • DOI
    10.1295/koron.46.413
  • COI
    1:CAS:528:DyaL1MXlvFGqu7o%3D
  • ISSN
    18815685
    03862186
    http://id.crossref.org/issn/03862186
  • 本文言語コード
    ja
  • データソース種別
    • JaLC
    • Crossref
    • CiNii Articles
  • 抄録ライセンスフラグ
    使用不可

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