ポリアミドイミド（ＰＡＩ）の研究　第２報　ポリアミドイミドの架橋と架橋物の物性

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タイトル別名
  • Studies on polyamideimides(PAI) II. The cross-linking of polyamideimides(PAI) and properties of the cross-linked PAI.
  • ポリアミドイミド ノ カキョウ ト カキョウブツ ノ ブッセイ

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抄録

The cross-linking by adding cross-linking agents to polyamideamide (PAI) resins was studied. The following results were obtained. (1) PAI can be cross-linked at lower temperatures than 200°C by some polyfunctional agents which react with end groups of PAI. (2) Polyfunctional epoxy compounds (especially ones derived from phenol-nevola. c resins) are the most effective cross-linking agents for PAI. (3) Melting temperatures of PAI can be enhanced more than 100°C by cross-linking with epoxy compounds. (4) But PAI cross-linked by epoxy compounds have a lower softening temperature (or glass transition temperature), lower thermal decomposition resistance, and a higher coefficient of thermal expansion compared with the original PAI. These effects are due to mixing of large amounts of epoxy compounds which are less heat resistant than PAI is. To effect cross-linking successfully, it is preferable to use cross-linking agents in as small amounts as possible.

収録刊行物

  • 高分子論文集

    高分子論文集 47 (7), 575-581, 1990

    公益社団法人 高分子学会

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