Ｃｕ板上のＳｎ－Ｐｂ合金のぬれ（第１報）　Ｃｕ板上のＳｕ－Ｐｂ合金のぬれ先端の界面構造

• 雀部 謙

  金属材料技術研究所

• 大橋 修

  金属材料技術研究所

書誌事項

タイトル別名

• Wetting of Sn-Pb Alloys on Cu Plate (1). Interface Structure at Wetting Tip of Molten Sn-Pb Alloy on Pure Cu Plate.
• Wetting of Sn-Pb Alloys on Cu Plate (1)
• Cu板上のSn-Pb合金のぬれ(第1報)

抄録

In order to make clear the mechanism of wetting and to treat it quantitatively, we tried to reveal the interface structure at advancing edge of Sn-Pb alloy droplet on Cu plate.<BR>Liquid droplet of alloy on a Cu plate was blown off by high speed Ar gas heated to a temperature of about 475 K, and concentrations of elements along the vertical cross section of interface were measured using AES analyser scraping by Ar sputtering.<BR>The results showed that Sn enrichment was formed at the interface immediately after melted down of alloy and the most outside edge of halo was Sn only.<BR>The experiment method used proved to be a useful method for the analyse of interface between liquid and solid.

収録刊行物

• 溶接学会論文集

  溶接学会論文集 11 (3), 401-404, 1993

  一般社団法人 溶接学会

キーワード

• Wetting
• Sn-Pb on Cu
• Interface structure
• Sn enrichment
• Halo

詳細情報

• CRID: 1390282679699100544
• NII論文ID: 130003934315
• DOI: 10.2207/qjjws.11.401
• ISSN: 24348252
• ISSN: 02884771
• 本文言語コード: ja
• データソース種別:
  • JaLC
  • Crossref
  • CiNii Articles
• 抄録ライセンスフラグ: 使用不可