書誌事項
- タイトル別名
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- Flow characteristics of epoxy resin systems for low pressure transfer molding.
- テイアツ トランスファー セイケイヨウ エポキシ ジュシ ノ リュウドウ トク
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抄録
Flow characteristics of silica filled trial epoxy resin systems having neither a curing agent nor a catalystwere examined in the absence of any chemical reaction that would cause a viscosity rise. A plunger extrusiontype of capillary rheometer was used in this study. Both molten materials, which had the same resin com-position except filler content, showed a power law fluid behaviour of slightly shear thinning over the observedranges of temperature and shear rate. The values of power law index ranged from around 0.83 to 0.95. Viscosity was found to be dominated by temperature rather than by shear rate under the present experi-mental conditions. A temperature difference of 40 degrees brought about a decade of viscosity change. The relationship between temperature and viscosity of each material was described by an Andrade's equation.
収録刊行物
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- 高分子論文集
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高分子論文集 43 (12), 873-879, 1986
公益社団法人 高分子学会
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詳細情報 詳細情報について
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- CRID
- 1390001206521671552
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- NII論文ID
- 130004034348
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- NII書誌ID
- AN00085011
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- ISSN
- 18815685
- 03862186
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- NDL書誌ID
- 3107189
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- 本文言語コード
- ja
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- データソース種別
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- JaLC
- NDL
- Crossref
- CiNii Articles
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- 抄録ライセンスフラグ
- 使用不可