Solid-Liquid Interdiffusion Bonding of Copper Using Ag-Sn Layered Films

• Fukumoto S.

  Graduate School of Engineering, Osaka University

• Miyake K.

  Graduate School of Engineering, Osaka University

• Tatara S.

  Graduate School of Engineering, Osaka University

• Matsushima M.

  Graduate School of Engineering, Osaka University

• Fujimoto K.

  Graduate School of Engineering, Osaka University

抄録

Newly developed bonded materials and fabrication processes are expected to firmly bond copper leads to SiC chips for application in next generation power modules. Solid-liquid interdiffusion bonding of copper was performed using Ag-Sn layered films. Microstructural development and mechanical properties of bond layers were investigated. The bond layer grew at the thin film interfaces because of the solid-liquid interdiffusion. Cu₆Sn₅ and Ag₄Sn or Ag₃Sn phases were formed at the initial bonding stage, and subsequently, Cu₃Sn formed between the Cu₆Sn₅ and Cu as both bond time and temperature increased. Finally, the bond layer was primarily composed of Ag₄Sn and Cu₃Sn. The hardness and Young’s modulus of Ag₄Sn were much lower than those of Cu₃Sn. The growth of the Cu₃Sn layer that formed between Ag₄Sn and Cu could be limited by optimizing the design of the faying surface.

収録刊行物

• MATERIALS TRANSACTIONS

  MATERIALS TRANSACTIONS 56 (7), 1019-1024, 2015

  公益社団法人 日本金属学会

キーワード

• interdiffusion
• bonding
• intermetallic compound
• power module
• Young’s modulus

詳細情報

• CRID: 1390282679230255872
• NII論文ID: 130005083564
• NII書誌ID: AA1151294X
• DOI: 10.2320/matertrans.mi201422
• ISSN: 13475320
• ISSN: 13459678
• NDL書誌ID: 026564663
• Web Site: http://id.ndl.go.jp/bib/026564663
• Web Site: https://ndlsearch.ndl.go.jp/books/R000000004-I026564663
• Web Site: https://www.jstage.jst.go.jp/article/matertrans/56/7/56_MI201422/_pdf
• 本文言語コード: en
• データソース種別:
  • JaLC
  • NDL
  • Crossref
  • CiNii Articles
  • KAKEN
• 抄録ライセンスフラグ: 使用不可