書誌事項
- タイトル別名
-
- Effect of Chromium Addition on the Thermal Conductivity of Cu/Diamond Composites Fabricated by SPS
- SPS セイケイ シタ ドウ/ダイヤモンド フクゴウ ザイリョウ ノ ネツ デンドウリツ ニ オヨボス Cr テンカ ノ エイキョウ
この論文をさがす
抄録
Diamond-particle-dispersed-copper (Cu) matrix composites were fabricated by spark plasma sintering (SPS) process from the mixture of diamond particles, pure-Cu and chromium (Cr) powders. The microstructures and the thermal conductivities of the composites fabricated were examined. These composites were all well consolidated at a temperature of 1173 K for 600 s by SPS process. No reaction at the interface between the diamond particle and the Cu matrix was observed by scanning electron microscopy and X-ray diffraction analysis for the composites fabricated under the sintering conditions employed in the present study. The relative packing density of the diamond particle dispersed Cu matrix composites with Cr addition was 4.4~5.9 % higher than that without Cr addition. The thermal conductivity of the Cu/diamond composite drastically increased with Cr addition. The thermal conductivity of (Cu-Cr)-50 vol% diamond composites was 518~584 W/mK in a volume fraction range of Cr between 2.5 and 8.6 vol% in Cu matrix. Numerous transgranular fractures of diamond particles were observed on the bending fracture surface of diamond particle dispersed Cu matrix composites with Cr addition, indicating strong bonding between the diamond particle and the Cu matrix in the composite.
収録刊行物
-
- 粉体および粉末冶金
-
粉体および粉末冶金 62 (7), 357-364, 2015
一般社団法人 粉体粉末冶金協会
- Tweet
詳細情報 詳細情報について
-
- CRID
- 1390282681286634368
-
- NII論文ID
- 130005089866
-
- NII書誌ID
- AN00222724
-
- ISSN
- 18809014
- 05328799
-
- NDL書誌ID
- 026618424
-
- 本文言語コード
- ja
-
- データソース種別
-
- JaLC
- NDL
- Crossref
- CiNii Articles
- KAKEN
-
- 抄録ライセンスフラグ
- 使用不可