Kinetics in Solid State Bonding of Superplastic Steel -Effect of Geometrical Factors of Surface Asperity on Contacting Modes and Bonding Mechanisms-

• HENG Zhonghao

  Division of Materials and Manufacturing Science, Graduate School of Engineering, Osaka University

• MATSUSHIMA Touma

  Division of Materials and Manufacturing Science, Graduate School of Engineering, Osaka University

• NASHIKI Yusuke

  Division of Materials and Manufacturing Science, Graduate School of Engineering, Osaka University

• MAEDA Masakatsu

  Department of Mechanical Engineering, College of Industrial Technology, Nihon University

• TAKAHASHI Yasuo

  Joining and Welding Research Institute, Osaka University

抄録

  The solid state bonding of fine-grained high carbon steel with different initial void shapes (surface asperities) was carried out. The contacting modes and predominant bonding mechanisms were investigated. The interfacial contacting process was influenced by the geometrical factor: initial void shape with the surface asperity angle α₀. The surface asperity angle changed the initial void shape on the bonding interface. When α₀ = 10 ～ 15 deg, the initial void shape was Lens-type. While α₀ = 40 ～ 45 deg, it was Massif-type by the observation of cross section on the bonding interface. Lens-type contacting process was controlled by surface folding mode, which showed a high bonding rate. On the other hand, Massif-type contacting process was controlled by both surface folding and interfacial expansion modes, which inhibited the contacting rate. In spite of two modes, it was found that superplastic deformation could be the predominant bonding mechanism if the bonding conditions, temperature and pressure were appropriate. In other words, it was identified from the stress exponent n value and the activation energy Q value of each bonding mechanism that superplastic flow played a dominant role in the interfacial contacting process from a bonding ratio of 30% to 40%, under the conditions of bonding temperature T = 1023 ～ 1053 K and bonding pressure P = 35 ～ 45 MPa.

収録刊行物

• Journal of Smart Processing

  Journal of Smart Processing 4 (2), 102-108, 2015-03-20

  一般社団法人 スマートプロセス学会 （旧高温学会）

キーワード

• Solid-state Bonding
• Superplastic Flow
• Predominant Mechanism
• Initial Void Shape
• Interfacial Contact

詳細情報

• CRID: 1390001205415651584
• NII論文ID: 130005119120
• NII書誌ID: AA12553487
• DOI: 10.7791/jspmee.4.102
• ISSN: 21871337
• ISSN: 2186702X
• NDL書誌ID: 026312717
• Web Site: http://id.ndl.go.jp/bib/026312717
• Web Site: https://ndlsearch.ndl.go.jp/books/R000000004-I026312717
• Web Site: https://www.jstage.jst.go.jp/article/jspmee/4/2/4_102/_pdf
• 本文言語コード: ja
• データソース種別:
  • JaLC
  • NDL
  • Crossref
  • CiNii Articles
• 抄録ライセンスフラグ: 使用不可