-
- Tasaki Takashi
- Corporate Development Dept., Research and Development H.Q., ARAKAWA CHEMICAL INDUSTRIES, LTD
-
- Shiotani Atsushi
- Corporate Development Dept., Research and Development H.Q., ARAKAWA CHEMICAL INDUSTRIES, LTD
-
- Yamaguchi Takashi
- Corporate Development Dept., Research and Development H.Q., ARAKAWA CHEMICAL INDUSTRIES, LTD
-
- Sugimoto Keisuke
- Corporate Development Dept., Research and Development H.Q., ARAKAWA CHEMICAL INDUSTRIES, LTD
抄録
<p>We developed solvent-soluble polyimides with good heat resistance and low dielectric constant (Dk)/dissipation factor (Df) characteristics by optimizing the composition ratio of the aliphatic, cycloaliphatic, and aromatic groups present in the polyimide back bone. We found that the adhesives prepared using our polyimides showed good adhesion to polyimide films and low profile copper foils and low Dk/Df. Furthermore, we developed a three-layer flexible copper clad laminate (3LFCCL) with our polyimde (PI) adhesives, low-pofile copper foils, and normal PI films. This 3LFCCL showed a transmission loss similar to that of liquid crystal polymer (LCP) FCCLs at frequencies less than 20 GHz. This result indicates that by using our PI adhesives, lower cost FCCLs can be prepared, which can then be used as high-frequency substrates.</p>
収録刊行物
-
- Transactions of The Japan Institute of Electronics Packaging
-
Transactions of The Japan Institute of Electronics Packaging 11 (0), E17-006-1-E17-006-7, 2018
一般社団法人エレクトロニクス実装学会
- Tweet
詳細情報 詳細情報について
-
- CRID
- 1390282680292828928
-
- NII論文ID
- 130006712520
-
- ISSN
- 18848028
- 18833365
-
- 本文言語コード
- en
-
- データソース種別
-
- JaLC
- Crossref
- CiNii Articles
-
- 抄録ライセンスフラグ
- 使用不可