MMLPA: Multilayered Metamaterial Low Profile Antenna for IoT Applications

DOI Web Site 参考文献3件
  • Rakotoaritina Tojoarisoa
    Department of Computer Science and Communications Engineering, Waseda University
  • Saito Megumi
    Department of Computer Science and Communications Engineering, Waseda University
  • Pan Zhenni
    Department of Computer Science and Communications Engineering, Waseda University
  • Liu Jiang
    Department of Computer Science and Communications Engineering, Waseda University
  • Shimamoto Shigeru
    Department of Computer Science and Communications Engineering, Waseda University

抄録

<p>Nowadays, within the concept of Internet of Things (IoT), smart homes, smart factory, intelligent transportation among others are infrastructure systems that connect our world to the Internet. However, wireless communications technology are considerably constrained by complicated structures, and lossy media in complex environments. Fundamental limitations on the transmission range have been treated to connect IoT devices in such Radio Frequency (RF) challenging environments. In order to extend the transmission range in complex environments, Magnetic Induction (MI) communication has been proved to be an efficient solution. In this paper, a Multilayered Metamaterial low profile antenna (MMLPA) using Magnetic Induction communication scheme is proposed for IoT applications. The system model of the MMLPA is analyzed. Then an MMLPA system is designed by using a circular loop antenna backed with isotropic metamaterial which is considered as a Defected Ground Structure (DGS) as well as with anisotropic metamaterial for the purpose of a dielectric uniaxial metamaterial. By using a full-wave finite-element method, the proposed analysis is supported with simulation results where good agreement is achieved compared to the measurement results after realizing four prototypes of the MMLPA antennas. The effect of the presence of metal in the vicinity of the transceivers is also analyzed.</p>

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