High-resolution temperature measurement of void dynamics induced by electromigration in aluminum metallization

DOI PDF 被引用文献2件
  • Seiichi Kondo
    Advanced Research Laboratory, Hitachi, Ltd., Hatoyama, Saitama 350-03, Japan
  • Kenji Hinode
    Central Research Laboratory, Hitachi, Ltd., Kokubunji, Tokyo 185, Japan

この論文をさがす

抄録

<jats:p>The local temperature of aluminum metallization is measured directly during electromigration. High resolution thermography is used to detect void dynamics induced by a dc current. In the vicinity of the growing area, infrared radiation pulses less than 0.5 s wide are observed concomitant with resistance pulses. Their amplitudes are found to correspond to a temperature increase of more than 200 °C, which locally exceeds the melting point of aluminum metallization. These pulses occur as a consequence of void movement. Healing of voids is discussed along with the results.</jats:p>

収録刊行物

被引用文献 (2)*注記

もっと見る

キーワード

詳細情報 詳細情報について

問題の指摘

ページトップへ