Solid phase epitaxy of stressed and stress-relaxed Ge-Si alloys
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- Q. Z. Hong
- Department of Materials Science and Engineering, Cornell University, Ithaca, New York 14853
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- J. G. Zhu
- Department of Materials Science and Engineering, Cornell University, Ithaca, New York 14853
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- J. W. Mayer
- Department of Materials Science and Engineering, Cornell University, Ithaca, New York 14853
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- W. Xia
- Department of Electrical and Computer Engineering, University of California, San Diego, La Jolla, California 92093
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- S. S. Lau
- Department of Electrical and Computer Engineering, University of California, San Diego, La Jolla, California 92093
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Abstract
<jats:p>Solid phase epitaxy of 3500-Å-thick GexSi1−x (0.04≤x≤0.12) films on (100) Si substrates has been investigated. The thickness of regrown layers increased linearly with annealing time in the temperature range of 475–575 °C. The regrowth rates of stressed alloys were less than those of pure Si, while stress-relaxed alloys have larger rates than Si. The difference in regrowth rates was explained by the activation-strain tensor model (Aziz, Sabin, and Lu, to be published in Phys. Rev. B). The first element of the activation-strain tensor obtained in this experiment was in excellent agreement with that deduced by Aziz et al. For low Ge concentrations (x<0.08), the recrystallized region was of good crystalline quality. However, threading dislocations were observed in a stressed Ge0.1Si0.9 alloy after complete recrystallization. During the regrowth at 550 °C, the Ge-Si alloy first regrew coherently up to 300 Å, above which threading dislocations started to nucleate. On the other hand, no dislocations were detected in the regrown layer of a stress-relaxed Ge0.1Si0.9 alloy sample.</jats:p>
Journal
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- Journal of Applied Physics
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Journal of Applied Physics 71 (4), 1768-1773, 1992-02-15
AIP Publishing
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Keywords
Details 詳細情報について
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- CRID
- 1360861294378134656
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- NII Article ID
- 30015848472
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- NII Book ID
- AA00693547
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- DOI
- 10.1063/1.351212
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- ISSN
- 10897550
- 00218979
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- Data Source
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- Crossref
- CiNii Articles