The Influence of Various Common Assumptions on the Boundary–Condition–Independence of Compact Thermal Models

• C.J.M. Lasance

収録刊行物

• IEEE Transactions on Components and Packaging Technologies

  IEEE Transactions on Components and Packaging Technologies 27 (3), 523-529, 2004-09

  Institute of Electrical and Electronics Engineers (IEEE)

キーワード

• Electrical and Electronic Engineering
• Electronic, Optical and Magnetic Materials

詳細情報

• CRID: 1361418520554004992
• NII論文ID: 30020088846
• DOI: 10.1109/tcapt.2004.831788
• ISSN: 15213331
• ISSN: http://id.crossref.org/issn/01486411
• Web Site: http://xplorestaging.ieee.org/ielx5/6144/29407/01331548.pdf?arnumber=1331548
• データソース種別:
  • Crossref
  • CiNii Articles