Step Coverage, Uniformity and Composition Studies Using Integrated Vapour Transport and Film-Deposition Models

• Dew Steven

  Department of Electrical Engineering, University of Alberta, Edmonton, AB, Canada, T6G 2G7

• Smy Tom

  Department of Electronics, Carleton University, Ottawa, ON, Canada, K1S 5B6

• Brett Michael

  Department of Electrical Engineering, University of Alberta, Edmonton, AB, Canada, T6G 2G7

抄録

A Monte Carlo sputter flux transport model has been developed for efficient generation of angular, energy, and thickness uniformity distributions for application to integrated circuit metallization films. The model allows for arbitrary target erosion profiles and emission angular distributions and uses an energy-dependent gas-scattering model. Verification of the model using aluminum and copper pinhole images has been obtained. The resulting sputter distribution information can be input into a topography-level film-deposition model to provide step coverage and microstructure depictions. The combination of these two models has been used to examine metallization issues such as film thickness uniformity, step coverage, compositional variations in alloy films, and magnetron source design.

収録刊行物

• Japanese Journal of Applied Physics

  Japanese Journal of Applied Physics 33 (2A), 1140-1145, 1994

  The Japan Society of Applied Physics

キーワード

• sputter distributions
• metallization
• composition variations
• step coverage

詳細情報

• CRID: 1390001206271268864
• NII論文ID: 130004519785
• NII論文ID: 30021835101
• NII論文ID: 210000035072
• NII書誌ID: AA10457675
• DOI: 10.1143/jjap.33.1140
• ISSN: 13474065
• ISSN: 00214922
• Web Site: https://iopscience.iop.org/article/10.1143/JJAP.33.1140
• Web Site: https://iopscience.iop.org/article/10.1143/JJAP.33.1140/pdf
• 本文言語コード: en
• データソース種別:
  • JaLC
  • Crossref
  • CiNii Articles
• 抄録ライセンスフラグ: 使用不可