Sn-Cu系鉛フリーはんだと銅との接合界面組織と機械的性質に及ぼす直流通電の影響  [in Japanese] Effect of direct current on structure of interface phase and mechanical properties of Sn-Cu-Ni solder/Cu joint  [in Japanese]

Journal

Copper and copper alloy  

Copper and copper alloy 48(1), 235-238, 2009 

日本伸銅協会

Codes

  • NII Article ID (NAID) :
    40016783381
  • NII NACSIS-CAT ID (NCID) :
    AA11995570
  • Text Lang :
    JPN
  • ISSN :
    13477234
  • NDL Article ID :
    10399626
  • NDL Source Classification :
    ZP41(科学技術--金属工学・鉱山工学)
  • NDL Call No. :
    Z17-336
  • Databases :
    NDL 

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