Interfacial Nano-Mechanical Properties of Copper Joints Bonded with Silver Nanopaste near Room Temperature

• Peng Peng

  Centre for Advanced Materials Joining, University of Waterloo

• He Peng

  State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology

• Zou Guisheng

  Department of Mechanical Engineering, Tsinghua University

• Liu Lei

  Department of Mechanical Engineering, Tsinghua University

• Zhou Y. Norman

  Centre for Advanced Materials Joining, University of Waterloo State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology Department of Mechanical Engineering, Tsinghua University

抄録

Sintering of nanomaterials at low temperatures has been demonstrated as an alternative for flexible electronic packaging. Silver nanowires were synthesized via polyol method and used as filler material for bonding copper to copper near room temperature. The experimental results indicated that both silver-to-silver and copper-to-silver formed metallurgical bonds. The elastic modulus and nano-hardness of copper joints at the copper-silver interface were characterized using nanoindentation. A transition layer at the interface was observed and its thickness was determined. Sintered silver filler material showed good elasticity both inside and out of the transition layer.

収録刊行物

• MATERIALS TRANSACTIONS

  MATERIALS TRANSACTIONS 56 (7), 1010-1014, 2015

  公益社団法人 日本金属学会

キーワード

• Interface
• diffusion
• hardness
• electronic packaging
• mechanical properties

詳細情報

• CRID: 1390001204253539456
• NII論文ID: 130005083561
• NII書誌ID: AA1151294X
• DOI: 10.2320/matertrans.mi201412
• ISSN: 13475320
• ISSN: 13459678
• NDL書誌ID: 026564622
• Web Site: https://ndlsearch.ndl.go.jp/books/R000000004-I026564622
• Web Site: https://www.jstage.jst.go.jp/article/matertrans/56/7/56_MI201412/_pdf
• 本文言語コード: en
• データソース種別:
  • JaLC
  • NDL
  • Crossref
  • CiNii Articles
• 抄録ライセンスフラグ: 使用不可