A study of numerical process and device modeling CAD for submicrometer CMOS サブミクロンCMOSプロセス/デバイスに関する数値モデリングに基づいたCADの研究
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Bibliographic Information
- Title
-
A study of numerical process and device modeling CAD for submicrometer CMOS
- Other Title
-
サブミクロンCMOSプロセス/デバイスに関する数値モデリングに基づいたCADの研究
- Author
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小田中, 紳二
- Author(Another name)
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オダナカ, シンジ
- University
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京都大学
- Types of degree
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工学博士
- Grant ID
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乙第7497号
- Degree year
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1991-03-23
Note and Description
博士論文
Table of Contents
- 論文目録 / (0001.jp2)
- ABSTRACT / p1 (0006.jp2)
- CONTENTS / p3 (0007.jp2)
- 1.INTRODUCTION / p1 (0014.jp2)
- 1.1 Introduction / p1 (0014.jp2)
- 1.2 History of Numerical Silicon Device Modeling / p2 (0015.jp2)
- 1.3 History of Numerical Silicon Process Modeling / p4 (0016.jp2)
- 1.4 CMOS:The Emerging VLSI Technology / p5 (0016.jp2)
- 1.5 Overview / p8 (0018.jp2)
- 2.NUMERICAL PROCESS MODELING AND SIMULATION / p11 (0019.jp2)
- 2.1 Introduction / p11 (0019.jp2)
- 2.2 Ion Implantation Model / p12 (0020.jp2)
- 2.3 Diffusion Model / p13 (0020.jp2)
- 2.4 Oxidation Model / p19 (0023.jp2)
- 2.5 Efficient Numerical Algorithms For Three-Dimensional Process Modeling / p25 (0026.jp2)
- 2.6 Applications to LOCOS and Trench Isolation Processes / p32 (0030.jp2)
- 2.7 Conclusions / p35 (0031.jp2)
- 3.NUMERICAL MOSFET MODELING AND SIMULATION / p36 (0032.jp2)
- 3.1 Introduction / p36 (0032.jp2)
- 3.2 Set of Semiconductor Device Equations / p37 (0032.jp2)
- 3.3 A Three-Dimensional CAD Model for 0.5 μm MOSFET / p41 (0034.jp2)
- 3.4 Avalanche Breakdown Simulation of Small Geometry MOSFET / p68 (0048.jp2)
- 3.5 Summary / p74 (0051.jp2)
- 4.DYNAMICS OF CMOS LATCHUP TURN-ON BEHAVIOR / p75 (0051.jp2)
- 4.1 Introduction / p75 (0051.jp2)
- 4.2 Transient Model for CMOS Latchup / p76 (0052.jp2)
- 4.3 CMOS Structure / p77 (0052.jp2)
- 4.4 Surface Induced Latchup Triggering By The Parasitic p-MOSFET / p81 (0054.jp2)
- 4.5 Latchup Triggering By Direct Forward Biasing / p86 (0057.jp2)
- 4.6 Discussion / p91 (0059.jp2)
- 4.7 Summary / p94 (0061.jp2)
- 5.A SELF-ALIGNED RETROGRADE TWIN-WELL STRUCTURE WITH BURIED p+₋LAYER / p95 (0061.jp2)
- 5.1 Introduction / p95 (0061.jp2)
- 5.2 Fabrication Sequence / p96 (0062.jp2)
- 5.3 Isolation Characteristics and CMOS latchup Immunity / p103 (0065.jp2)
- 5.4 Conclusions / p107 (0067.jp2)
- 6.DESIGN OF HALF-MICROMETER p-CHANNEL MOSFET / p108 (0068.jp2)
- 6.1 Introduction / p108 (0068.jp2)
- 6.2 Scaling Down of Buried p-Channel MOSFETs / p109 (0068.jp2)
- 6.3 A New Buried p-Channel MOSFET / p114 (0071.jp2)
- 6.4 Device Characteristics / p115 (0071.jp2)
- 6.5 Summary / p121 (0074.jp2)
- 7.CHARACTERIZATION OF TRENCH ISOLATED p-CHANNEL MOSFET / p123 (0075.jp2)
- 7.1 Introduction / p123 (0075.jp2)
- 7.2 Trench Isolation Process / p124 (0076.jp2)
- 7.3 Experimental Results and Simulations / p126 (0077.jp2)
- 7.4 Narrow-Width Effects of Trench Isolated p-Channel MOSFET / p127 (0077.jp2)
- 7.5 Conclusions / p131 (0079.jp2)
- 8.SUMMARY AND CONCLUSIONS / p133 (0080.jp2)
- TECHNICAL PAPERS,INTERNATIONAL CONFERENCE,AND DOMESTIC CONFERENCE / p137 (0082.jp2)
- OTHER PAPERS RELATED TO THIS THESIS / p140 (0084.jp2)
- REFERENCES / p143 (0085.jp2)