Factors affecting the wettability of solid metals by liquid metals 液体金属による固体金属のぬれ性に影響する因子
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Bibliographic Information
- Title
-
Factors affecting the wettability of solid metals by liquid metals
- Other Title
-
液体金属による固体金属のぬれ性に影響する因子
- Author
-
Hasouna, Amal Tawfik
- Author(Another name)
-
ハスナー, アマル トフィ
- University
-
大阪大学
- Types of degree
-
工学博士
- Grant ID
-
甲第4337号
- Degree year
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1991-03-26
Note and Description
博士論文
Table of Contents
- CONTENTS / (0004.jp2)
- CHAPTER1 GENERAL INTRODUCTION / p1 (0006.jp2)
- 1.1 Wetting phenomenon / p1 (0006.jp2)
- 1.2 Historical background of factors affecting the wetting phenomenon / p7 (0009.jp2)
- 1.3 Scope of the research / p9 (0010.jp2)
- References / p12 (0012.jp2)
- CHAPTER2 EXPERIMENTAL METHOD / p14 (0013.jp2)
- 2.1 Introduction / p14 (0013.jp2)
- 2.2 Experimental method and apparatus / p14 (0013.jp2)
- 2.3 Measurements and calculations of the oxygen partial pressures in the ambient atmospheres / p19 (0015.jp2)
- 2.4 Calculation of the contact angle / p21 (0016.jp2)
- 2.5 Calculation of the surface tension of liquid metals / p24 (0018.jp2)
- 2.6 Materials / p25 (0018.jp2)
- 2.7 Summary / p27 (0019.jp2)
- References / p28 (0020.jp2)
- CHAPTER3 EFFECTS OF TIME AND TEMPERATURE ON THE WETTA-BILITY IN THE IRON-BISMUTH AND COPPER-TIN SYSTEMS / p29 (0020.jp2)
- 3.1 Introduction / p29 (0020.jp2)
- 3.2 Solid Fe―liquid Bi system / p30 (0021.jp2)
- 3.3 Solid Cu―liquid Sn system / p32 (0022.jp2)
- 3.4 Conclusions / p39 (0025.jp2)
- References / p41 (0026.jp2)
- CHAPTER4 EFFECT OF OXYGEN PARTIAL PRESSURE ON THE WETTA-BILITY IN THE COPPER-TIN AND IRON-BISMUTH SYSTEMS / p42 (0027.jp2)
- 4.1 Introduction / p42 (0027.jp2)
- 4.2 Solid Cu―liquid Sn system / p43 (0027.jp2)
- 4.3 Solid Fe―liquid Bi system / p46 (0029.jp2)
- 4.4 Effect of oxygen partial pressure on the wettability of solid Fe by liquid Bi / p55 (0033.jp2)
- 4.5 Conclusions / p65 (0038.jp2)
- References / p67 (0039.jp2)
- CHAPTER5 EFFECTS OF SURFACE FINISH,HEAT TREATMENT AND COLD WORKING ON THE WETTABILITY OF SOLID COPPER BY LIQUID TIN / p69 (0040.jp2)
- 5.1 Introduction / p69 (0040.jp2)
- 5.2 Effect of surface finish of solid Cu on its wettability by liquid Sn / p70 (0041.jp2)
- 5.3 Effect of heat treatment of solid Cu on its wettability by liquid Sn / p78 (0045.jp2)
- 5.4 Effect of cold working of solid Cu on its wettability by liquid Sn / p81 (0046.jp2)
- 5.5.Conclusions / p84 (0048.jp2)
- References / p85 (0048.jp2)
- CHAPTER6 GENERAL CONCLUSIONS / p86 (0049.jp2)
- LIST OF PUBLICATIONS / p90 (0051.jp2)
- ACKNOWLEDGEMENT / p91 (0051.jp2)