Effect of third element on the mechanical reliability of Sn-3.5 mass%Ag lead-free solder for microjoining and anti-fatigue damage design in the development of new lead-free Solder

この論文をさがす

著者

    • 苅谷, 義治 カリヤ, ヨシハル

書誌事項

タイトル

Effect of third element on the mechanical reliability of Sn-3.5 mass%Ag lead-free solder for microjoining and anti-fatigue damage design in the development of new lead-free Solder

著者名

苅谷, 義治

著者別名

カリヤ, ヨシハル

学位授与大学

芝浦工業大学

取得学位

博士(工学)

学位授与番号

甲第12号

学位授与年月日

1999-03-18

注記・抄録

博士論文

目次

  1. Contents / (0003.jp2)
  2. 1 General Introduction / p1 (0008.jp2)
  3. 1.1 Tin-lead solders / p1 (0008.jp2)
  4. 1.2 Soldering in electronics industry and reliability issue / p2 (0009.jp2)
  5. 1.3 Environmental concerns of lead / p5 (0010.jp2)
  6. 1.4 Development of new lead free solder alloys for micro joining / p12 (0014.jp2)
  7. 1.5 Aim of this study / p18 (0017.jp2)
  8. 2 Effect of Element on the Melting Properties and Wetting Properties of Wetting Properties of Sn-3.5Ag Solder Alloys / p22 (0019.jp2)
  9. 2.1 Introduction / p22 (0019.jp2)
  10. 2.2 Thermodynamics of wetting / p23 (0019.jp2)
  11. 2.3 Evaluation of wetting properties of solder / p26 (0021.jp2)
  12. 2.4 Experimental procedure / p33 (0024.jp2)
  13. 2.5 Experimental result and discussion / p36 (0026.jp2)
  14. 2.6 Conclusion in this chapter / p46 (0031.jp2)
  15. 3 Microstructure and Tensile Properties of Bulk Solder / p49 (0032.jp2)
  16. 3.1 Introduction / p49 (0032.jp2)
  17. 3.2 Experimental procedure / p50 (0033.jp2)
  18. 3.3 Result and discussion / p53 (0034.jp2)
  19. 3.4 Conclusion of this chapter / p70 (0043.jp2)
  20. 4 Isothermal Fatigue Properties of Bulk Solder / p73 (0044.jp2)
  21. 4.1 Introduction / p73 (0044.jp2)
  22. 4.2 Experimental procedure / p74 (0045.jp2)
  23. 4.3 Result and discussion / p77 (0046.jp2)
  24. 4.4 Conclusion in this chapter / p102 (0059.jp2)
  25. 5 Microstructure and Shear Properties of Solder / Copper Joint / p108 (0062.jp2)
  26. 5.1 Introduction / p108 (0062.jp2)
  27. 5.2 Experimental procedure / p109 (0062.jp2)
  28. 5.3 Results and discussion / p113 (0064.jp2)
  29. 5.4 Conclusion of this chapter / p133 (0074.jp2)
  30. 6 Isothermal Fatigue Properties of Solder / Copper Joint / p136 (0076.jp2)
  31. 6.1 Introduction / p136 (0076.jp2)
  32. 6.2 Experimental procedure / p137 (0076.jp2)
  33. 6.3 Results and discussion / p141 (0078.jp2)
  34. 6.4 Conclusion in this chapter / p159 (0087.jp2)
  35. 7 Conclusion(Anti-Fatigue Damage Design in the Development of New Lead-Free Solder) / p163 (0089.jp2)
2アクセス

各種コード

  • NII論文ID(NAID)
    500000172024
  • NII著者ID(NRID)
    • 8000000172299
  • DOI(NDL)
  • NDL書誌ID
    • 000000336338
  • データ提供元
    • NDL-OPAC
    • NDLデジタルコレクション
ページトップへ