LED Array Modules by New Technology Microbump Bonding Method

• HATADA K.

収録刊行物

• IEEE Transactions on CHMT

  IEEE Transactions on CHMT 13 521-527, 1990

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• CRID: 1572543026542003712
• NII論文ID: 80005350147
• NII書誌ID: AA00667751
• データソース種別:
  • CiNii Articles