Thermal Cycling Induced Plastic Deformation in Solder Joints-part 1 : Accumulated Deformation in Surface Mount Joints

• PAN T. Y.

収録刊行物

• ASME Journal of Electronic Packaging

  ASME Journal of Electronic Packaging 113 8-15, 1991

詳細情報

• CRID: 1572543026548730368
• NII論文ID: 80005809401
• データソース種別:
  • CiNii Articles