Surface activated bonding of silicon wafers at room temperature

• TAKAGI H.

Journal

• Appl. Phys. Lett.

  Appl. Phys. Lett. 68 (16), 2222-2224, 1996

Details

• CRID: 1570009751784093696
• NII Article ID: 80008897328
• Data Source:
  • CiNii Articles